- In electronics, heat from operation, extended use, or external factors can disrupt the functionality of sensitive components, reduce performance, lower the lifespan of products, and cause user discomfort. Conventional techniques to manage or dissipate heat suffer from low performance, bulkiness, and insufficient thermal insulation capabilities.
- This technology features patent-pending materials and production methods for organic polyimide (PI) aerogels for thermal management.
- Emerging from leading research at Prof. Hani Naguib’s Toronto Smart Materials & Structures (TSMART) lab, this novel combination of organic PI aerogel materials and film processing techniques exhibits significantly-improved thermal insulation and functional properties using no chemical crosslinker.
- Features:
- Ultra-lightweight (density <0.05 g/cm3)
- High service temperature (>530˚ C)
- High porosity (>90%)
- Ultra-high thermal insulation (thermal conductivity >19 mW/m.K)
- High moisture resistance and hydrophobic
- Ultra-low dielectric constant (<2)
- Mechanical robustness (E>20 MPa)
- Mechanical flexibility (bendability)
- Custom, controllable size (thickness >0.1 mm) and shape configurability, machinability, and formability
BENEFITS
- Due to their ultra-lightweight and excellent thermal insulation properties not available in existing solutions, these aerogels show promising results for reducing heat in electronics, hotspot reduction, enhancing users’ comfort, and protecting heat-sensitive components.
- Existing silica aerogel-based technologies and conventional solutions like cooling pads, thermal pastes, heat sinks, and heat pipes with coolant have limited operating temperatures (<100˚C), insufficient mechanical flexibility, inability to customize shapes, limited operating temperature, and relatively large density, which limit their performance and applicability.
- Our aerogels provide better performance and controllable size and shape, making them favourable for thermal management over a wider range of potential applications.
APPLICATIONS
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This technology can be used in diverse applications in (micro)electronics, quantum computing, tablets, workstations, laptops, desktops, displays, 5G antennas, solar panels, and more for outcomes including:
- Reducing heat in electronics and antennas
- Hotspot reduction
- Maintaining integrity of signals
- Protection of components from excessive heat, overheating, or continuous heating
- Enhanced user comfort
STATUS
- US Patent filed Sept 2023 (In prosecution)
- The aerogels have been validated in a laboratory environment, and ongoing work will be on scaling up manufacturing for implementation in electronic devices.
- Seeking strategic collaborators for development, validation, and licensing.
ID:
P2413
Donna Shukaris
Donna Shukaris
Innovations & Entrepreneurship Manager
Innovations & Partnerships Office (IPO)
(416) 946-7247
